LTCC (Low Temperature Co-fired Ceramics) combines multilayer ceramics, ultra-fine conductor structures, and integrated passive components in a robust 2.5D substrate. The result: compact assemblies with outstanding high-frequency performance up to the millimeter wave (mmW) range, low power dissipation, high thermal stability, and maximum reliability in harsh environmental conditions. Our PI paste technology (Photoimageable paste systems) takes LTCC mmW components to the next level: line widths and spacings in the double-digit µm range (≥ 20 µm), precise via fillings, sharp edges, and reproducible geometries minimize parasitic effects, increase packing density, and improve yield. PI pastes are based on additive printing and maskless exposure processes, seamlessly coupling printed functions (antennas, sensors, filters) with ceramic reliability. Discover at LOPE-C how PI technology makes your ceramic (RF) components smaller, faster, and more reliable—from prototype to series production.