XTPL’s Ultra-Precise Dispensing (UPD) technology is an advanced additive manufacturing method for nanomaterial deposition with unmatched precision and versatility. UPD enables direct writing of conductive and non-conductive inks — including silver nanoinks — with feature sizes from with a resolution of 1 to 50 μm, allowing highly accurate material placement for complex microstructures. It supports a wide range of substrates (glass, silicon, polymers, flexible foils) and accommodates diverse materials such as photoresists, quantum dot inks, and polyimides. UPD excels in applications requiring micro- and nano-scale interconnects, high-density circuitry, and open-defect repair, and is suitable for sectors like advanced PCBs, MEMS, flexible hybrid electronics, biosensors, & high-performance displays. Its customizable parameters, scalability from prototyping to production, and compatibility with existing lines make UPD a key enabling technology for next-generation electronics manufacturing.