VFP Ink Technologies
Presentation of our SE Form Conductive Ink
XTPL S.A.
Advanced Packaging with #XTPL Technology
Fraunhofer-Institut für Elektronische Mikrosysteme und Festkörper-Technologien EMFT
Reel-to-Reel: Printing the Future of Electronics
Covestro
Platilon® TPU films
Witte Technology GmbH
finest conductive structures (< 50 µm)
Silicon Austria Labs (SAL) GmbH
KERMIT patch
RK Siebdrucktechnik GmbH
RKS CARBON HT PK
Föhrenbach Application Tooling NV
Flexible Circuits Crimping and related equipment
HeiQ Xpectra GmbH
HeiQ Xpectra transparent conductive coating
Dracula Technologies
LAYER® your sustainable alternative to batteries
Lüscher Technologies AG
MultiDX! - The All-Rounder for High Demands
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