Witte Technology GmbH
finest conductive structures (< 50 µm)
NanoSen GmbH
Flexible Materials for Force Sensing
Hamamatsu Photonics Deutschland GmbH
SPOLD and DDL for precise, thermal laser sintering
Seristampa Srl
IME-forming-special effect-haptic feedback demo
Shenzhen Hochuen Technologies Co., Ltd.
Vertically Integrated Manufacturer
Fujikura Kasei Co., Ltd. Electronics Materials Division
DOTITE Stretchable Silver Pastes
Fraunhofer Institut für Solare Energiesysteme ISE
Printed Electronics meets Solar
tesa SE
"Debonding on Demand" Solutions
HighLine Technology GmbH
HighLine Dispensing Systems
Hahn-Schickard-Gesellschaft für angewandte Forschung e.V.
MikroBo - functionalized earmold
Vitzrocell
Vitzrocell Thin Film Battery
DROP AG
DROP AG Phoenix DLES CtS
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