Presentations (171)

finest conductive structures (< 50 µm)

Witte Technology GmbH

finest conductive structures (< 50 µm)

Flexible Materials for Force Sensing

NanoSen GmbH

Flexible Materials for Force Sensing

SPOLD and DDL for precise, thermal laser sintering

Hamamatsu Photonics Deutschland GmbH

SPOLD and DDL for precise, thermal laser sintering

IME-forming-special effect-haptic feedback demo

Seristampa Srl

IME-forming-special effect-haptic feedback demo

Video: Vertically Integrated Manufacturer
Play

Shenzhen Hochuen Technologies Co., Ltd.

Vertically Integrated Manufacturer

DOTITE Stretchable Silver Pastes

Fujikura Kasei Co., Ltd. Electronics Materials Division

DOTITE Stretchable Silver Pastes

Printed Electronics meets Solar

Fraunhofer Institut für Solare Energiesysteme ISE

Printed Electronics meets Solar

"Debonding on Demand" Solutions

tesa SE

"Debonding on Demand" Solutions

Video: HighLine Dispensing Systems
Play

HighLine Technology GmbH

HighLine Dispensing Systems

MikroBo - functionalized earmold

Hahn-Schickard-Gesellschaft für angewandte Forschung e.V.

MikroBo - functionalized earmold

Vitzrocell Thin Film Battery

Vitzrocell

Vitzrocell Thin Film Battery

DROP AG Phoenix DLES CtS

DROP AG

DROP AG Phoenix DLES CtS