Fraunhofer-Institut für Fertigungstechnik und Angewandte Materialforschung IFAM
Lagerschalen mit integrierter Temperatursensorik
Nanotechnology Lab LTFN / COPE-Nano
LTFN Booklet
Functional Print Cluster
PRINTING VALUE, EMPOWERING INDUSTRY
Voltera
NOVA Materials Dispensing System
Covestro
Platilon® TPU-Folien
NanoSen GmbH
Flexible Materialien für Kraftsensorik
THIEME GmbH & Co.KG
THIEME - Druckmaschinen
ABeetle Corporation
High Density Printed Circuits
DP Patterning AB
Innovative Technologie für Flex Elektronik (FPCB)
XTPL S.A.
Advanced Packaging with #XTPL Technology
Embega, S. Coop.
Printed Electronics
Adaptronics s.r.l.
Adaptronics Company Presentation
http%3A%2F%2Fexhibitors.lopec.com%2F%2Fprj_869%2Fview%2Findex.cfm%3Felb%3D866.1155.1636.2.624807%26lng%3D1%26nv%3D70.1