XTPL S.A.
Advanced Packaging with #XTPL Technology
DP Patterning AB
Innovative technology for Flex Electronics (FPCB)
tesa SE
"Debonding on Demand" Solutions
ARKEMA France CRRA
Arkema Piezotech
E Ink
E Ink Innovation for the BMW i5 Flow NOSTOKANA
Fraunhofer-Institut für Fertigungstechnik und Angewandte Materialforschung IFAM
Webinar "From nanoparticle to smart system"
PrintCB
Printable Copperpaste for the electronic
Adaptronics s.r.l.
Adaptronics Company Presentation
RK Siebdrucktechnik GmbH
RKS HT3
Flextem GmbH
PTC heating foils and temperature sensors
nsm Norbert Schläfli AG
Modular Roll-to-Roll Thin Film Coating System
HX Production Group Limited
Factory video
http%3A%2F%2Fexhibitors.lopec.com%2F%2Fprj_869%2Fview%2Findex.cfm%3Felb%3D866.1126.2294.1.468428%26lng%3D2%26nv%3D70.1