Presentations (171)

PC, PET & coated Film for printed electronics

HX Production Group Limited

PC, PET & coated Film for printed electronics

Printed Electronics

Embega, S. Coop.

Printed Electronics

SPOLD and DDL for precise, thermal laser sintering

Hamamatsu Photonics Deutschland GmbH

SPOLD and DDL for precise, thermal laser sintering

Multi-layer ceramic high-frequency components with PI pastes

Fraunhofer-Institut für Keramische Technologien und Systeme IKTS

Multi-layer ceramic high-frequency components with PI pastes

PRO Flextronics

PRO Flextronics / M2N Media GmbH

PRO Flextronics

ATMA-TI C 80PD/C

SPS TechnoScreen GmbH

ATMA-TI C 80PD/C

Printed Electronics meets Solar

Fraunhofer Institut für Solare Energiesysteme ISE

Printed Electronics meets Solar

Video: Proell-IMD/FIM-Process Steps
Play

Pröll GmbH

Proell-IMD/FIM-Process Steps

"Debonding on Demand" Solutions

tesa SE

"Debonding on Demand" Solutions

Printed Electronics for Stick-to-Skin Wearables

ADDEV Materials

Printed Electronics for Stick-to-Skin Wearables

Video: Production of microfluidic disposables
Play

Hahn-Schickard-Gesellschaft für angewandte Forschung e.V.

Production of microfluidic disposables

KERMIT patch

Silicon Austria Labs (SAL) GmbH

KERMIT patch