AKONEER laser micromachining systems - for the products of tomorrow
Company profile
Akoneer provides laser machines for R&D, electronics, semiconductor, medical and defence markets.
Coming back to LOPEC we are introducing equipment for our groundbreaking patented SSAIL technology for HDI PCB, advanced semiconductor packaging, laser surface texturing and laser turning. Using SSAIL, copper traces can be added on any dielectric material (organics, glass, ceramics, etc.).
Main features of SSAIL:
Trace width: from 1 µm
Typical trace thickness: 5-7 µm
Very high adhesion strength
High throughput process
Materials: glass, FR4, PI, ABF, PE, PTFE, and almost any other dielectric material.
Coming back to LOPEC we are introducing equipment for our groundbreaking patented SSAIL technology for HDI PCB, advanced semiconductor packaging, laser surface texturing and laser turning. Using SSAIL, copper traces can be added on any dielectric material (organics, glass, ceramics, etc.).
Main features of SSAIL:
Trace width: from 1 µm
Typical trace thickness: 5-7 µm
Very high adhesion strength
High throughput process
Materials: glass, FR4, PI, ABF, PE, PTFE, and almost any other dielectric material.
Product presentations
AKO 300/600 Systems
Application areas
Products and services
Contact
AKONEER
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