CEA Structural Electronics Platform (PICTIC )
The PICTIC platform develops, on sheet to sheet mode, smart plastics, papers, and textiles which are produced by combining printing electronics functions together with silicon based devices. The applications include the development of human-machine interfaces, actuators, sensors and drivers.
This R&D facility is unique in Europe as it brings together, in a single area, high level expertise and a range of different printing and assembly machines. Moreover, the platform is surrounded with design, characterization and reliability research groups. The platform has expertise in scaling up printing processes for industrial partners and in prototyping electronic devices. It has track record of world wide industrial collaborations with USA, Asia and European companies.
CEA is member of the consortium of InSCOPE (grant agreement No 731671) and Smartees (grant agreement No. 761496) H2020 projects.