Industry directory
Welcome to the
industry directory
of LOPEC 2024
Exhibitor list
tesa SE
Light-curing structural bonding tape
tesa L-tape combines the high bonding strength of structural bonding adhesives with PSA-like handling.
ELANTAS Europe GmbH
Printed Electronics
Conductive inks, insulating materials, conductive/non-conductive adhesives
Coatema Coating Machinery GmbH
Equipment for Printed Electronics
Lab, pilot and production equipment for S2S and R2R production of PE products
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Smart Living
Products and applications of printed electronics for our future everyday life:
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LOPEC app 2024
More information
Mobility
Insights and outlooks in printed electronics, e.g. for automotive and aerospace:
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Featured companies
RK Siebdrucktechnik GmbH
RKS – SPECIALISTS IN SQUEEGEES
Fraunhofer ENAS
Fraunhofer ENAS Printed Functionalities
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Products/Services
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Product gallery
tesa SE
tesa's Bond & Detach® solutions
Fraunhofer Institute for Applied Polymer Research IAP
Ink development for Inkjet and EHD-Jet printing
XTPL S.A.
XTPL. Powering the microelectronics of tomorrow.
FEDRIGONI
Sustainable Smart Packaging solutions
ABeetle Corporation
High-Density Multi-Layer Screen-Thru-Hole Circuits
EMBEGA S.Coop.
Printed Sensors
Normandy Coating
NORMANDY COATING and printed electronics
HUMMINK
High Precision Capillary Printing
Lüscher Technologies AG
MultiDX! - The All-Rounder for High Demands
KELENN Technology
DMD400®
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Application areas
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Videos
Sefar AG
3E Smart Solutions
E+R Group
Kissel + Wolf GmbH (KIWO)
Yamagata University Innovation Center for Organic Electronics
RK Siebdrucktechnik GmbH
ioTech - Reophotonics Ltd.
E Ink Corporation
Kundisch GmbH & CO. KG
tesa SE
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