Industry directory
Welcome to the
industry directory
of LOPEC 2024
Exhibitor list
tesa SE
Light-curing structural bonding tape
tesa L-tape combines the high bonding strength of structural bonding adhesives with PSA-like handling.
Coatema Coating Machinery GmbH
Equipment for Printed Electronics
Lab, pilot and production equipment for S2S and R2R production of PE products
ELANTAS Europe GmbH
Printed Electronics
Conductive inks, insulating materials, conductive/non-conductive adhesives
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Smart Living
Products and applications of printed electronics for our future everyday life:
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LOPEC app 2024
More information
Mobility
Insights and outlooks in printed electronics, e.g. for automotive and aerospace:
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Featured companies
Fraunhofer ENAS
Fraunhofer ENAS Printed Functionalities
RK Siebdrucktechnik GmbH
RKS – SPECIALISTS IN SQUEEGEES
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Products/Services
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Product gallery
Fraunhofer Institut für Solare Energiesysteme ISE
Printed Electronics meets Solar
THIEME GmbH & Co.KG
THIEME Screen and digital printing machines
Föhrenbach Application Tooling NV
Flexible Circuits Crimping and related equipment
tesa SE
Solutions for next generation solar modules
FlexiSens at Helmholtz-Zentrum Dresden-Rossendorf (HZDR)
Printable flexible magnetic field sensors
RK Siebdrucktechnik GmbH
RKS CARBON HT
Yamagata University Innovation Center for Organic Electronics
Near Infrared OLED
Nuovo Film Inc.
Silver Nanowires
Seristampa Srl
IME-forming-special effect-haptic feedback demo
ABeetle Corporation
High-Density Multi-Layer Screen-Thru-Hole Circuits
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Application areas
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Videos
Kimoto Ltd
EURECAT - Technology Centre
Silicon Austria Labs
TracXon B.V.
Teca-Print AG
JOANNEUM RESEARCH Forschungsgesellschaft mbH
THIEME GmbH & Co.KG
Grafisk Maskinfabrik A/S
OrelTech
Fraunhofer Institute for Applied Polymer Research IAP
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