Fraunhofer IZM specializes in applied and industrial contract research. Within System Integration and Interconnect Technologies, the range of services spans consultation, process development, right through to technical systems. Developing processes for interconnection technologies on board, flex, module and package levels and the integration of electrical, optical and power-electronic components are at the forefront of our research. In the area of Wearable & Conformable Electronics we develop packaging technologies for flexible, stretchable or formable substrates based on polymerics and textiles. This opens up a wide range of options, from expanding functions, e.g. using sensors or lighting in textiles or medical applications, to developing completely new types of three-dimensional interactive electronic systems. We focus on technologies such as stretchable substrate patterning, low-temperature interconnect and encapsulation technologies as well as lamination and thermoforming.