As part of the Fraunhofer-Gesellschaft, Fraunhofer IZM specializes in applied and industrial contract research. Within the field of system integration and interconnect technologies, the range of services spans consultation, to process development, right through to technical system solutions.
In the area of Wearable & Conformable Electronics we develop and qualify packaging technologies for flexible, stretchable or formable substrates based on polymerics and textiles. This opens up a wide range of options, from expanding functions, e.g. using sensors or lighting in textiles or medical applications, to developing completely new types of three-dimensional interactive electronic systems.
We focus on technologies such as stretchable substrate generation and patterning, low-temperature interconnect and encapsulation technologies as well as lamination and thermoforming.