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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM

Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
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Ultra-thin flip-chip Thermoplastic substrates Electronics in textiles

Company profile

As part of the Fraunhofer-Gesellschaft, Fraunhofer IZM specializes in applied and industrial contract research. Within the field of system integration and interconnect technologies, the range of services spans consultation, to process development, right through to technical system solutions.

In the area of Wearable & Conformable Electronics we develop and qualify packaging technologies for flexible, stretchable or formable substrates based on polymerics and textiles. This opens up a wide range of options, from expanding functions, e.g. using sensors or lighting in textiles or medical applications, to developing completely new types of three-dimensional interactive electronic systems.

We focus on technologies such as stretchable substrate generation and patterning, low-temperature interconnect and encapsulation technologies as well as lamination and thermoforming.

Product presentations

Integrating electronic systems into textiles

Integrating electronic systems into textiles

Screen and stencil printing of inks and pastes

Screen and stencil printing of inks and pastes

Thin flexible substrates for medical applications

Thin flexible substrates for medical applications

Formable Electronics

Formable Electronics

Contact

Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Gustav-Meyer-Allee 25, 13355 Berlin, Germany
F
+49 30 46403-111
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Ms. Christine Kallmayer
Group Manager System-on-Flex
System Integration & Interconnection Technologies
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Mr. Julian Haberland
Group System-on-Flex
System Integration & Interconnection Technologies
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Mr. Christian Dils
Group System-on-Flex
System Integration & Interconnection Technologies
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Mr. Dr. rer. nat. Vitalij Scenev
Group System-on-Flex
System Integration & Interconnection Technologies
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Mr. Joao Alves Marques
Group System-on-Flex
System Integration & Interconnection Technologies
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Mr. Georg Weigelt
Marketing & Geschäftsfeldentwicklung